High-Speed Mixed-Signal Design Engineer

HIGH-SPEED MIXED SIGNAL DESIGN ENGINEER

Our optical hardware platform requires tightly integrated high-speed electronic and photonic systems operating at tens of gigahertz and beyond—modulator drivers, trans-impedance amplifiers, SerDes interfaces, and the analog signal chains that connect them. We are seeking a High-Speed Mixed-Signal Design Engineer to architect, design, and validate the high-speed electronic systems that interface directly with our photonic integrated circuits. You will work across the boundary between electronics and photonics, from transistor-level circuit design through package and board-level integration, ensuring the electrical systems meet the bandwidth, linearity, and noise performance our optical links demand.

RESPONSIBILITIES:

• Design and analyze high-speed analog and mixed-signal circuits for electro-optic systems, including modulator drivers, TIAs, CTLEs, limiting amplifiers, and clock/data recovery circuits
• Develop and own circuit-level and system-level models for high-speed signal chains, incorporating device parasitics, package effects, and photonic component behavior
• Perform transistor-level simulation and verification using industry tools (e.g., Cadence Virtuoso, Spectre, ADS, HFSS) across process corners, temperature, and supply variation
• Architect high-speed electrical interfaces between electronic ICs and photonic integrated circuits, defining impedance matching, bandwidth targets, voltage swing, and power constraints
• Lead or contribute to chip-to-package-to-board co-design, including high-speed interconnect design, SI/PI analysis, and signal integrity closure from die through PCB
• Collaborate with PIC designers to co-optimize electro-optic performance across the driver–modulator and photodetector–TIA interfaces
• Define characterization and validation strategies for high-speed electronic and electro-optic subsystems, including S-parameter measurements, eye diagram analysis, and BER testing
• Analyze measurement data and correlate to simulation models, driving root-cause investigation and design iteration
• Partner with manufacturing and test engineering teams to develop production test methods for high-speed electrical and electro-optic assemblies
• Contribute to component selection, evaluation, and qualification for high-speed electronic devices (e.g., driver ICs, TIAs, CDRs, PLLs)

QUALIFICATIONS:

• Master's or PhD in electrical engineering, applied physics, or a related discipline
• 3+ years of experience in high-speed analog, mixed-signal, or RF circuit design, with emphasis on circuits operating at multi-GHz bandwidths
• Strong foundation in analog and RF circuit design principles, including small-signal and large-signal analysis, noise analysis, and stability
• Experience with circuit simulation tools (e.g., Cadence Spectre, ADS, HFSS, or equivalent)
• Understanding of high-speed serial link architectures and signaling formats (e.g., NRZ, PAM4, coherent modulation)
• Experience with high-speed lab characterization, including use of high-bandwidth oscilloscopes, VNAs, BERTs, and spectrum analyzers
• Working knowledge of semiconductor device physics and IC fabrication processes (CMOS, SiGe BiCMOS, or III-V)
• Strong programming and data analysis skills (e.g., Python, MATLAB) for simulation automation, data processing, and visualization
• Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE:

• Experience designing high-speed circuits for optical communications, including modulator drivers, TIAs, or SerDes front-ends
• ASIC or custom IC design experience, including full design flow from specification through tapeout and silicon validation
• Experience with high-speed package and interconnect design, including wirebond, flip-chip, or co-packaged optics integration
• Deep expertise in one or more of: wideband amplifier design (>25 GHz), high-speed DAC/ADC interfaces, PLL/CDR design, or RF power amplifier design
• Familiarity with DSP concepts relevant to optical links (e.g., FFE, DFE, CTLE equalization) and optical performance metrics (e.g., OSNR, OMA, receiver sensitivity)
• Experience with electromagnetic simulation for high-speed interconnects and packaging (e.g., HFSS, Momentum, CST)
• Experience with photonic-electronic co-design or co-simulation (e.g., Lumerical Interconnect, VPI, ADS co-simulation)
• Experience working with silicon photonics or III-V electro-optic platforms
• Familiarity with reliability and qualification testing for high-speed electronic or electro-optic assemblies

COMPENSATION AND BENEFITS:

Pay range:
High-Speed Mixed Signals Design Engineer: $140,000.00 - $190,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

• Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
• Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
• Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
• 401(k) retirement plan access.
• Relocation assistance to sunny Los Angeles.