Photonics Packaging Engineer
Hybrid Remote/SF Bay Area/Austin/Boston
- Level
- Mid
- Work type
- Remote
Not stated in the posting: salary, visa.
Open. First seen 3 October 2026.
About the role
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
- Experience with large device count photonic assemblies
- Experience with clear underfill
- Experience with high density fiber attach
- Experience with large substrate size photonic MCM assemblies
- Hands-on experience with PIC design
The team: Advanced Packaging
This role is one of 5 open in Advanced Packaging.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
PCB Design (1 of 5)
OTHER ROLES ON THIS TEAM
- Packaging Engineer- Flip Chip posted Jul 24
- Packaging Engineer- Materials posted Jul 24
- Packaging Engineer- Bump Interconnect posted Jul 23
- Advanced Packaging Engineer posted Jul 23
From the team and dates on Volantis Semiconductor, Inc.'s own job board.
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