Physics AI - Thermal-Mechanical Reliability

Our core technology features the world’s fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don’t just make simulations faster; we make the “impossible” solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond.

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging.

You will lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. You aren’t just using tools; you are defining the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale.

Requirements

• Education: PhD in Mechanical Engineering, Materials Science, Physics, or a related field with a deep specialization in computational multi-physics.
• Subject Matter Authority: Recognized expertise in 3D-IC reliability, with a profound understanding of the mechanics of warpage, interfacial delamination, and thermal-mechanical coupling in heterogeneous integration.
• AI/Simulation Fluent: A strong perspective on the role of GPU acceleration and Machine Learning in scientific computing.
• Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.

Responsibilities

• Strategic Leadership: Own the technical roadmap for the thermal-mechanical domain. Define how our Physics AI accelerates traditional FEA/multi-physics workflows to provide real-time reliability insights.
• Architectural Innovation: Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
• High-Stakes Collaboration: Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute’s speed transforms their iterative design cycles from days to minutes.
• Product Influence: Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
• Team Building: Recruit, mentor, and lead a high-performing team of engineers specialized in computational mechanics and AI-driven physics.

Benefits

• Competitive compensation with equity of a fast-growing startup.
• Medical, dental, and vision health insurance.
• 401(k) Contribution.
• Gym allowance.
• Friendly, thoughtful, and intelligent coworkers.