Principal/Senior Engineer, Process Engineering (Advanced Packaging)

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Minimum Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.