Hardware Reliability Engineer

About the role:

Own the reliability of the advanced packages and systems that turn our AI accelerator silicon into products that survive years in the field. You'll define how we qualify 2.5D/3D and heterogeneously-integrated packages, model their physics of failure, drive root-cause when things fail, and build the reliability engineering that lets us predict lifetime under real workloads. You'll sit at the seam between silicon/packaging and the systems our accelerators run in, partner closely with our OSATs, and own the answer to "will this hold up in the field — and for how long?

What you'll do

• Reliability analysis & risk assessment: Conduct physics-of-failure modeling for advanced accelerator packaging; assess thermal, mechanical, and electrical stressors; define and execute stress-test protocols including thermal cycling, electromigration, HTOL, HAST/uHAST, and power cycling
• Failure analysis & root cause: Lead failure-mode analysis using C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD; identify cracking, voiding, electromigration, and stress-induced damage; drive corrective/preventive action (8D, FMEA)
• Reliability physics & lifetime prediction: Build and apply models (Coffin-Manson, Arrhenius, Black's equation) and FEA-based stress simulation to predict field lifetime and FIT under real accelerator thermal and power profiles
• OSAT management & collaboration: Partner with assembly and test providers on reliability improvements; define requirements, ensure JEDEC/IPC/IEEE/MIL-STD compliance, monitor OSAT performance, and support supplier audits and qualifications
• System-level reliability: Assess thermal, mechanical, and electrical stress interactions across package, board, and the system the accelerator ships in; drive design-for-reliability into the package and board ↔ package interface with packaging, materials, SI/PI, and thermal
• Cross-functional close-out: Develop design guidelines and reliability best practices, and own the reliability data presented to internal teams and customers
• Fleet & data-center reliability: Translate package- and system-level reliability into fleet availability targets — AFR, FIT, MTBF/MTTR, and availability "nines"; drive detection and mitigation of silent data corruption (SDC) / silent data errors in production; close the loop from field telemetry, returns, and RMA back into design and qual (reliability growth); partner with data-center operations, SRE/hardware-ops, and customers on serviceability and uptime for large-scale training and inference
• Use and develop AI-assisted / ML tool flows to accelerate failure analysis, lifetime modeling, and failure prediction

What we're looking for:

• MS or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or related field
• 5+ years in 2.5D/3D advanced packaging reliability
• Deep command of physics-of-failure methodology and strong materials-science knowledge, particularly interconnects and interfaces
• Proficiency in statistical reliability analysis (Weibull, lognormal, acceleration modeling; JMP, Minitab, or Python)
• Hands-on failure analysis with C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD
• Proven track record driving OSAT/partner improvements and managing qualifications
• Familiarity with JEDEC, IPC, IEEE, and MIL-STD standards
• Heterogeneous integration, fan-out packaging, chiplet architectures, HBM, or silicon-photonics packaging
• Electrical reliability mechanisms (electromigration, dielectric/TDDB breakdown)
• Design-for-reliability (DFR), prognostics, and health management for electronic systems
• AI-driven reliability modeling or machine learning for failure prediction
• High-power / high-current package reliability for accelerators or GPUs; customer-facing qualification experience

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.

Equal Opportunity

Full compensation packages are based on candidate experience and relevant certifications.

California pay range

$132,000—$220,000 USD

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.