Senior Analyst Engineer - Thermal

Position Overview

We are seeking a talented Senior Analyst Engineer to work in our satellite mechanical subsystem & payload team, with a focus on thermal analysis and on the reliability of electronic components (EEE parts), and a background in mechanical analysis, contributing to the design, analysis, specification, testing and validation of spacecraft hardware.

The successful candidate will be innovative, creative, and challenge the status quo. He or she will work well in teams while also having the ability to lead analysis activities and to work assignments autonomously.

Key Responsibilities:

· Lead the thermal analysis of satellite subsystems and payload: build and maintain thermal mathematical models, and perform steady-state and transient analyses for orbital and test environments.
· Perform reliability analysis of electronic components: component rating and derating margin calculations according to ECSS standards (e.g. ECSS-Q-ST-30-11), using thermal analysis results for junction/case temperatures, and reliability predictions as required.
· Support thermal design and engineering trade-offs, defining thermal requirements, interfaces, materials and thermal control solutions together with the mechanical and electrical teams.
· Support thermal vacuum (TVAC) testing: test definition, predictions, and correlation of thermal models with test results.
· Perform structural and thermo-elastic analyses (static, modal, random vibration, shock, thermal distortion/stress) to support mechanical design decisions.
· Prepare and maintain analysis reports and documentation demonstrating compliance with requirements, and technical support to AIT activities.

Qualifications

Education:

· Bachelor's degree in Mechanical, Aerospace or related technical field.
· Higher degree is preferred.

Experience:

· At least 5 years of hands-on experience in thermal analysis of spacecraft subsystems and payload and/or other equivalent applications.

Preferred Qualifications:

· Demonstrated experience with thermal analysis tools (e.g. Ansys Workbench, Thermal Desktop, ESATAN-TMS or equivalent).
· Demonstrated experience in reliability of electronic (EEE) components, including rating and derating margin calculations according to ECSS standards (e.g. ECSS-Q-ST-30-11 and related dependability standards).
· Knowledge of failure analysis methods (FMECA/FMEA), reliability prediction and EEE parts selection for space applications.
· Background in mechanical analysis (FEM) using standard tools (e.g. Ansys Workbench, Patran, Hypermesh, Nastran, Abaqus) and classical structural analysis methods.
· Knowledge of thermal control hardware and thermal testing.

Soft Skills:

· Demonstrated ability to work in a multidisciplinary team with other engineers.
· Flexibility/adaptability in a fast-paced & dynamic environment.
· Fluent English written and verbal communication skills.

Technology Stack:

· Ansys Workbench.
· Thermal Desktop.
· ESATAN-TMS.
· FEM analysis tools.
· Patran.
· Hypermesh.
· Nastran.
· Abaqus.

Physical Requirements

· Ability to work in a standard office environment and use a computer for extended periods.
· Ability to work on-site at the Barcelona office.