Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform
- Level
- Lead
- Work type
- Hybrid · Hyderabad
Not stated in the posting: salary, visa.
Open. First seen 22 October 2026.
About the role
Kandou AI's standard text
At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
We are looking for a Customer Platform, SDK & Interoperability Architect.
Location: Hyderabad, India
Responsabilities
· Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.
· Define stable APIs, extension points and versioning contracts that support customer-specific requirements without forking the core platform.
· Own C and Python management libraries, command-line tools, log-analysis utilities, integration examples and developer documentation.
· Lead interoperability and qualification across NIC, switch-ASIC and host-BMC platforms; maintain the test matrix, known-failure catalog and regression strategy.
· Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.
· Partner with firmware, platform validation, product management and field engineering to deliver secure, backward-compatible and supportable customer releases.
Essential Experience
· 10+ years of platform, embedded or systems software experience, including architecture or technical leadership on shipping products.
· Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage or comparable high-speed hardware.
· Strong API and SDK architecture skills with hands-on C and/or C++ plus Python development.
· Experience designing adaptation, plugin or hook-based architectures that isolate customer-specific logic behind stable interfaces.
· Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers or management software.
· Experience with semantic versioning, backward compatibility, release governance and technical documentation for external developers.
· Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP or similar protocols.
Excellent customer communication, technical decision-making and cross-functional leadership skills; BS in Electrical Engineering, Computer Engineering or Computer Science, or equivalent experience.
Useful Experience
· CMIS, OSFP MSA, SFF conventions or pluggable-module management software.
· Hyperscaler or tier-one OEM qualification and field-issue triage.
· REST, gRPC, Go or Rust bindings, and schema-driven API development.
· Telemetry pipelines, diagnostic analytics and privacy-aware customer data handling.
· Hardware-in-loop lab automation, host emulation and automated interoperability testing.
· Secure software supply chain, artifact signing, access isolation and standards-group participation.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would love to hear from you. Together We Kandou It!!
What this role asks for
Particular to this role
Golang · REST · Rust · gRPC
Rare in Kandou AI's other 33 open postings.
82% of this description is written for the role. The rest is Kandou AI's standard text, folded away below.
Compared with Kandou AI's other open jobs.
The team: Engineering HIRES STEADILY
This role is one of 15 open in Engineering. 5 were posted in the last 30 days and the oldest in August: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (11 of 15), C (8 of 15), C++ (7 of 15), Embedded Systems (7 of 15), RTOS (5 of 15), CMake (3 of 15), FPGA (3 of 15)
OTHER ROLES ON THIS TEAM
- Platform Validation Lead / Manager posted Oct 12
- Embedded Software Technical Lead posted Oct 12
- Firmware Lead posted Oct 12
- Software Architect posted Sep 24
- System Firmware Lead (AI Memory Fabrics) – CXL/PCIe Memory fabric controller posted Sep 11
- Internship - AI Engineer posted Sep 9
- Board Product Project Control Coordinator (PCC/ PJE) posted Sep 9
- Analog Layout Engineer (Lead) posted Sep 7
- Internship - Semiconductor Engineering posted Sep 1
- Physical Design Engineers - 2 openings posted Aug 19
- Firmware Engineer Bare Metal posted Aug 19
- Firmware Architect posted Aug 19
- Digital Design Engineers - 7 openings posted Aug 19
- Digital Design Engineer, UK, CH posted Aug 19
From the team and dates on Kandou AI's own job board.
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