【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer
- Level
- Junior
- Work type
- On-site · Hsinchu City
Not stated in the posting: salary, visa.
Open. First seen 26 October 2026.
About the role
Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping…
What this role asks for
Particular to this role
PCB Design
Rare in Qualcomm's other 299 open postings.
Compared with Qualcomm's other open jobs.
The team: Packaging Engineering HIRES STEADILY
This role is one of 7 open in Packaging Engineering. 3 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (5 of 7), C (4 of 7), C++ (4 of 7), PCB Design (4 of 7), ANSYS (3 of 7), MATLAB (3 of 7), Perl (2 of 7)
OTHER ROLES ON THIS TEAM
- Principal Thermal Engineer posted Oct 26
- Central Hardware Systems – EE Automation Engineer, up to Sr. posted Oct 8
- Staff Engineer, Thermal posted Oct 5
- Packaging SIPI Engineer, Sr. Staff posted Sep 17
- RF Electromagnetic (EM) Engineer - San Diego posted Sep 17
- Senior Engineer - IC Package Design posted Jul 31
From the team and dates on Qualcomm's own job board.
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