Senior Engineer - IC Package Design
- Level
- Senior
- Work type
- On-site · Bengaluru
Not stated in the posting: salary, visa.
Open. First seen 26 October 2026.
About the role
Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: General Summary: Role Overview We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design…
What this role asks for
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Packaging Engineering HIRES STEADILY
This role is one of 7 open in Packaging Engineering. 3 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (5 of 7), C (4 of 7), C++ (4 of 7), PCB Design (4 of 7), ANSYS (3 of 7), MATLAB (3 of 7), Perl (2 of 7)
OTHER ROLES ON THIS TEAM
- Principal Thermal Engineer posted Oct 26
- Central Hardware Systems – EE Automation Engineer, up to Sr. posted Oct 8
- Staff Engineer, Thermal posted Oct 5
- Packaging SIPI Engineer, Sr. Staff posted Sep 17
- RF Electromagnetic (EM) Engineer - San Diego posted Sep 17
- 【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer posted Jul 26
From the team and dates on Qualcomm's own job board.
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