Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
- Level
- Intern
- Work type
- On-site · San Diego
- Visa
- Not offered
Not stated in the posting: salary.
Open. First seen 27 October 2026.
About the role
Company: Qualcomm Technologies, Inc. Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW General Summary: About Qualcomm Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting…
What this role asks for
Particular to this role
MATLAB · Verilog
Rare in Qualcomm's other 299 open postings.
Standard for embedded / hardware roles
C++ · Embedded Systems
Common in embedded / hardware postings at any company.
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Interim Engineering Intern - HW
This role is one of 15 open in Interim Engineering Intern - HW.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (15 of 15), C (12 of 15), C++ (12 of 15), Perl (9 of 15), Verilog (9 of 15), Embedded Systems (6 of 15), Linux (5 of 15)
OTHER ROLES ON THIS TEAM
- Mechanical Engineering Internship – Summer 2027 posted Sep 18
- RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027 posted Sep 18
- FY27 Intern - MSIP Digital Design Verification Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - IP Applications Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Silicon Validation Engineer, Electrical and Optical Systems Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Silicon Validation Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Display IP Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Compute DSP/AI Processor Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Physical Mixed Layout Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Firmware / Embedded - Canada (12 or 16 months) posted Sep 17
- Intern- AI Integration & Interoperability posted Apr 20
From the team and dates on Qualcomm's own job board.
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