FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months)
- Salary
- $54,600 - $103,350
- Level
- Intern
- Work type
- On-site · Toronto
Not stated in the posting: visa.
Open. First seen 27 October 2026.
About the role
Company: Qualcomm Canada ULC Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform…
What this role asks for
Particular to this role
Unix · Verilog
Rare in Qualcomm's other 299 open postings.
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Interim Engineering Intern - HW
This role is one of 15 open in Interim Engineering Intern - HW.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (15 of 15), C (12 of 15), C++ (12 of 15), Perl (9 of 15), Verilog (9 of 15), Embedded Systems (6 of 15), Linux (5 of 15)
OTHER ROLES ON THIS TEAM
- Mechanical Engineering Internship – Summer 2027 posted Sep 18
- RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027 posted Sep 18
- Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027 posted Sep 18
- FY27 Intern - MSIP Digital Design Verification Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - IP Applications Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Silicon Validation Engineer, Electrical and Optical Systems Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Silicon Validation Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Display IP Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Compute DSP/AI Processor Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Physical Mixed Layout Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Firmware / Embedded - Canada (12 or 16 months) posted Sep 17
- Intern- AI Integration & Interoperability posted Apr 20
From the team and dates on Qualcomm's own job board.
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