Qualcomm

Staff IC Packaging Engineer - Mechanical Simulation

San Diego, California, United States of America
Salary
$160,200 - $240,200
Level
Staff
Work type
On-site · San Diego

Not stated in the posting: visa.

Open. First seen 27 October 2026.

About the role

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's…

Read the full posting on careers.qualcomm.com

What this role asks for

Particular to this role

ANSYS · FEA

Rare in Qualcomm's other 299 open postings.

Compared with Qualcomm's other open jobs.

The team: Packaging Engineering HIRES STEADILY

This role is one of 15 open in Packaging Engineering. 7 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.

WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS

Python (9 of 15), PCB Design (8 of 15), ANSYS (7 of 15), C (7 of 15), C++ (7 of 15), MATLAB (7 of 15), Perl (3 of 15)

OTHER ROLES ON THIS TEAM

From the team and dates on Qualcomm's own job board.

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