Advanced Package Design Engineer – Principal Engineer
- Salary
- $210,000 - $315,000
- Level
- Principal
- Work type
- On-site · San Diego
Not stated in the posting: visa.
Open. First seen 7 November 2026.
About the role
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a Principal Engineer to build and lead a 2.5D/3D Advanced Package Design team within CHS, supporting next-generation high-performance…
What this role asks for
Particular to this role
ANSYS
Rare in Qualcomm's other 299 open postings.
Standard for software engineering roles
Python
Common in software engineering postings at any company.
Compared with Qualcomm's other open jobs.
The team: Packaging Engineering HIRES STEADILY
This role is one of 31 open in Packaging Engineering. 15 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
PCB Design (19 of 31), Python (13 of 31), ANSYS (11 of 31), C (11 of 31), C++ (11 of 31), MATLAB (11 of 31), Perl (6 of 31)
OTHER ROLES ON THIS TEAM
- Package Design Engineer - Staff posted Nov 6
- Sr RF Electromagnetic (EM) Engineer posted Nov 3
- Sr. Staff Engineer, Thermal - AI Compute posted Nov 3
- Staff Thermal Engineer posted Nov 3
- Package Design Engineer – Principal Engineer posted Nov 2
- Package Design Engineer - Staff posted Nov 2
- IC Packaging Substrate Engineer, up to Staff posted Nov 2
- Principal Thermal Engineer posted Oct 26
- Staff IC Packaging Engineer - Mechanical Simulation posted Oct 20
- Packaging SIPI Engineer, Sr. Staff posted Oct 16
- Senior SI/PI Engineer (High-Speed Systems) posted Oct 14
- Signal and Power Integrity Engineer, Senior to Staff Level posted Oct 14
- Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations posted Oct 13
- RF Package Design Engineer, Senior Staff posted Oct 13
- Central Hardware Systems – EE Automation Engineer, up to Sr. posted Oct 8
- Staff Engineer, Thermal posted Oct 5
- Sr. Staff Packaging Engineer- Process Package Integrity & Bumping posted Sep 25
- SIPI Engineer, Sr. posted Sep 22
- Principal IC Packaging Engineer posted Sep 17
- Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego) posted Sep 17
- Voltage Regulator (VR) Architect posted Sep 17
- Director, IC Packaging Engineering – Mechanical Simulation posted Sep 17
- Packaging SIPI Engineer, Sr. Staff posted Sep 17
- Package Design Engineer - Staff posted Sep 17
- RF Electromagnetic (EM) Engineer - San Diego posted Sep 17
- Packaging SIPI Engineer, Principal Engineer posted Sep 17
- IC Package Design Engineer, Staff posted Sep 8
- Thermal Engineer, Staff posted Aug 20
- 【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer posted Jul 26
- IC Package Layout Engineer, Staff posted Jul 6
From the team and dates on Qualcomm's own job board.
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